The lowest heat transfer coefficient among heat insulating materials.
All boards have excellent machinability (hand, machine or CNC milling).
Balanced mechanical properties, dimensional stability, thermal and chemical resistance.
cost-effective, universal, strong and durable.
safe for health and the environment - recyclable.
a wide range of formulations in several densities and sizes.
PUR board / panel without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~30-38 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 150 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board / panel without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~42 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 230 kPa at 10% depressurization dimensional tolerance +/-1%
PIR board/panel insulation PIRBLOCK AL consists of an insulating core of rigid PIR foam (Polyisocyanurate). Both sides of the board are protected by an airtight layer (aluminium, paper and polyethylene). coefficient of thermal conductivity λ=0.022 (W/mK) volumetric weight: 30±2 kg/m3 reaction to fire E Maximum compressive stress ≥ 130 kPa at 10% depressurization Quantity: 1 pc
PUR board / panel without lamination. Sale of the whole package only. The price for 1 pack is shown below. coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~30-38 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 150 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board / panel without lamination. Sale of the whole package only. The price for 1 pack is shown below. coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~42 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 230 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~50 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 300 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~63 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 400 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~80 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 500 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~105 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 800 kPa at 10% depressurization dimensional tolerance +/-1%
Material PUR - POLYURETHANE Quantity: 100 pcs/pack Sale of the whole package only. The price for 1 pack is shown below. Technical specifications: Diameter: Ø 65-70 mm Length: 15 mm Thermal conductivity coefficient: λᴅ 0.023 W/mK reaction to fire F (B3) dimensional tolerance +/-1mm
Material PUR - POLYURETHANE Quantity: 1 pcs Technical specifications: Diameter: Ø 65-70 mm Length: 1000 mm Thermal conductivity coefficient: λᴅ 0.023 W/mK reaction to fire F (B3) dimensional tolerance +/-1mm
Material PUR - POLYURETHANE. Quantity: 1 pc (100x100x1000mm) Length: 1000 mm Size: as required coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~38 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 150 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board / panel without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~42 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 230 kPa at 10% depressurization dimensional tolerance +/-1%
