The lowest heat transfer coefficient among heat insulating materials.
All boards have excellent machinability (hand, machine or CNC milling).
Balanced mechanical properties, dimensional stability, thermal and chemical resistance.
cost-effective, universal, strong and durable.
safe for health and the environment - recyclable.
a wide range of formulations in several densities and sizes.
PUR board / panel without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~30-38 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 150 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board / panel without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~42 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 230 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board / panel without lamination. Sale of the whole package only. The price for 1 pack is shown below. coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~30-38 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 150 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board / panel without lamination. Sale of the whole package only. The price for 1 pack is shown below. coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~42 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 230 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~50 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 300 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~63 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 400 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~80 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 500 kPa at 10% depressurization dimensional tolerance +/-1%
PUR board without lamination. Quantity: 1 pc coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~105 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 800 kPa at 10% depressurization dimensional tolerance +/-1%
Material PUR - POLYURETHANE Quantity: 100 pcs/pack Sale of the whole package only. The price for 1 pack is shown below. Technical specifications: Diameter: Ø 65-70 mm Length: 15 mm Thermal conductivity coefficient: λᴅ 0.023 W/mK reaction to fire F (B3) dimensional tolerance +/-1mm
Material PUR - POLYURETHANE Quantity: 1 pcs Technical specifications: Diameter: Ø 65-70 mm Length: 1000 mm Thermal conductivity coefficient: λᴅ 0.023 W/mK reaction to fire F (B3) dimensional tolerance +/-1mm
Material PUR - POLYURETHANE. Quantity: 1 pc (100x100x1000mm) Length: 1000 mm Size: as required coefficient of thermal conductivity λ=0.023 (W/mK) volumetric weight: ~38 kg/m3 heat resistance – 30°C to +125°C reaction to fire F (B3) Maximum compressive stress ≥ 150 kPa at 10% depressurization dimensional tolerance +/-1%
